|1918||Minoru Ishikawa is engaged in the manufacture of solder and white metal, and serve on the acquisition of technology.|
|1935||Ishikawa metal Industries inc. is founded as the individual companies.|
|1946||After the war, buiness is resumed at Naniwa-ku, Osaka-shi Ebisu-cho.|
|1952||Ishikawa metal Industries Co.Ltd is reorganized to Corporation, depending on the progress of the business.|
|1955||Awarded license of JIS indication by Ministry of International Trade and Industry about white metal.|
|1959||Awarded license of JIS indication by Ministry of International Trade and Industry about solder..|
|1967||Awarded license of JIS indication by Ministry of International Trade and Industry about flux cored solder. wire.|
|1976||Toru Ishikawa was Appointed as CEO|
|1978||Participated in the Sakai machinery Kinzokudanchi cooperatives relocated to the current location.
for the sake of Pollution elimination and productivity improvement. renamed to Ishikawa Metal Co..
|1980||Awarded license of The MIL standard certification by the Defense Agency.|
|1983||Developed the "Super Rosin GX".for spattering preventing solder for precision electronic parts corresponding to the needs of the industry due to the deployment of advanced technology field.|
|1984||Developed the "Stechron" solder containing an active agent corresponding to the diversification of the base material.|
|1985||Developed the solder paste "Soldim" corresponding to the needs of surface mount technology which is evolving.|
|1987||Developed the "Super Rosin GXM and GXR" less flux spattaring and solder ball type based on Super Rosin GX technology.|
|1988||Developed the "Soldim color" corresponding to the automatic recognition of the solder paste printing in SMT.|
|1991||Developed RMA solder paste for Nitrogen furnace and air reflow furnace and also for chip standing preventing.|
|1992||Developed flux cored solder wire TT53 with ultra-low scattering properties. Development patent application of solder with resistance for heat shock.|
|1993||US patented the solder paste corresponding light beam heating.|
|1995||Get the US national standard of the flux cored solder wire "Super Rosin GXM" and "Stechron RA" and the solder paste "Soldim 878" (ANSI / J-STD). Development patent application of flux cored solder wire "Taflock" Scattering of flux, and the residue of crack, solder enters heat which prevent flux spattering, the residue of crack, and heat lean.|
|1996||Development patent application of Lead-free solder.|
|2000||Development patent application of "Alumax" for aluminum coil soldering.|
|2002||KIX Techno Center completed
Established China Wuxi factory
Patent application Copper erosion preventing lead-free solder.
Patent application low spattaring ree solder High workability, solder "SPM" patent application Cored low scattering lead-free.
|2007||Patent application "E series" chip erosion prevent type flux cored solder wire.|
|2008||Patent application "8900" active-controlled lead-free solder paste.|
|2010||Representative Director in Hiroshi Ishikawa appointed.|
|2011||Jointly developed with Denso, high reliability lead-free flux cored solder wire "DDL", "DDH" residue crack prevention type,also patent application.|