Flux cored solder wire
High reliability halogen free standard compliant type HRK series
Good wettability
Adding a special activators other than Cl and Br. Good wettability, while compliant to halogen-free standards.
Excellent wettability
●Soldering test by robot
Good wettability
-
Compare wettability to the back through hole
【Condition】
Iron temp:350℃
Soldering time:1 sec
PCB:Cu, Through-hole
Halogen-free compliant
No intentional addition of chlorine(Cl) and bromine(Br), which causes dioxins.Compliant with most of halogen-free standards.
Halogen-free compliant
●Compliant situation of HRK series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/42/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Compatible to major halogen-free standards
Reduce flux spattering
The effect of special activators reduce the spattering and enables to secure a higher quality soldering.
Greatly reduced spattering
●Spattering test by robot
Very few spattering
-
Collect spattered flux onto
thermal paper.【Condition】
Iron temp:380℃
Feed speed:15mm/s
Feed lenght:5mm×200 shots
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55) |
|---|---|
| Flux type | Harogen-free type |
| Flux contents (%) | 2.0％、3.0％、4.0％、6.0％ |
| Halide contents | 0.08%～0.50% |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | HRK |
