Flux cored solder wire
Completely halogen free type HFC series
Good wettability
Adding a special activators other than Cl and Br. Good wettability while compliant to halogen-free standards.
Good wettability
●Soldering test with soldering robot
Equivalent wettability to Halogen-containing products
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【Condition】
Iron temp:400℃
Iron speed:20mm/s
PCB:Cu, one side
Completely halogen-free
No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with current all halogen-free standards.
Halogen-free compliant
●Compliant situation of HFC series
![](https://system.web-thorugh.jp/ishikawa_metal/uploads/evasol/45/""_m.)
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Compliant |
Comply to all of halogen free standards
Solderable to the flame base material
Good wettability even for nickel and brass.Can solder with various components.
Solderable to the flame base material
●Wettability test for base material plate
Solderable to various base material
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55) |
|---|---|
| Flux type | Halogen free type |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | less than 0.3% |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×109Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than100 |
| Flux name | HFC |
