Solder paste (syringe)
Residue flow prevent type solder paste BH63E3021F
Applying high viscosity flux for LASER soldering.
Achieve good appearance after soldering.
Alloy type | Sn63-Pb |
---|---|
Flux type | MIL-RMA |
Halide contents(%) | 0.04±0.01% |
Powder particle size(μm) | 53~38 |
Flux contents(%) | 11.0±0.5% |
Copper plate corrosion | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | more than 5.0×108Ω |
Electrochemical migration | No migration |
Flux name | 3021 |