Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Osaka

Ishikawa Metal Co.,LTD

TÜV RHEINLAND CERTIFIED

Management System
ISO 9001:2015
ISO 14001:2015

Certified office:Head office factory

  • 7-21 Chikkoh Hamadera Nishimachi Nishi-ku Sakai City, Osaka 592-8352, Japan
  • TEL:(Representative)072-268-1155
    (Product and Technical Inquiries)072-268-1156
  • FAX:072-268-1159
  • info@ishikawa-metal.com

Special usage

Halogen free solder
Background about Halogen free

In the case of solder material, halogens such as Cl, Br, etc. are used in the flux to improve solder wettability and workability. However, dioxins, which is harmful to living things, may be generated when incinerating an electronic board containing halogen, Cl or Br.
Halogen free is for measures of dioxin, to try to regulate the halogen to be used for the electronic board.

Halogen free standard and our halogen free type products
Standard Contents of standard
JPCA-ES01
IEC61249-2-21
IPC4101B
Halogen content in the copper-clad laminate
Chlorine (Cl) content: 900 ppm or less
Bromine (Br) content: 900 ppm or less
Total amount of chlorine (Cl) and bromine (Br) content: 1500 ppm
規格 規格の内容
JEITA_ET-7304A Halogen content of solid content in solder material flux
Fluorine (F) content: less than 1000 ppm
Chlorine (Cl) content: less than 1000 ppm
Bromine (Br) content: less than 1000 ppm
Iodine (I) content: less than 1000 ppm

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